Hsinchu Science Park - Established 1997
Silicon architecture and integrated connectivity platforms.
3nm
node fabrication standard
2B+
annual silicon shipments
100%
die-level RF integration
Silicon Domains
Core platforms optimized for compute density, thermal efficiency, and peripheral reduction.
Mobile Computing
Edge AI Telematics
Wireless Infrastructure
Advanced SoCs
Automotive Silos
Connectivity Cores
High-efficiency processing cores built to sustain multi-gigabit throughput under strict mobile power envelopes.
Integrated neural processing units engineered for real-time vehicular telemetry and autonomous edge routing.
Die-level Wi-Fi and 5G baseband integration designed to eliminate external BOM overhead for global OEMs.
Engineering Principles
Die-level efficiency mandates balance peak computational density with strict thermal boundaries.
Institutional Telemetry
Manufacturing scale and regional reach
1997
establishment year
+886
Taiwan headquarters
24/7
engineering support desk
Technical inquiries and integration support route directly through our Hsinchu Science Park engineering office.